Insights on the Wafer Level Packaging Global Market to 2026 - by Packaging Technology, End-use Industry and Region - ResearchAndMarkets.com
Insights on the Wafer Level Packaging Global Market to 2026 - by Packaging Technology, End-use Industry and Region - ResearchAndMarkets.com
DUBLIN--(BUSINESS WIRE)--The "Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2021-2026" report has been added to ResearchAndMarkets.com's offering.
都柏林--(美國商業新聞網)--《晶圓級包裝市場：2021-2026年全球產業趨勢、份額、規模、增長、機遇與預測》報告新增Research andMarkets.com的獻祭。
The global wafer level packaging market experienced strong growth during 2015-2020. Looking forward, the publisher expects the market to grow at a CAGR of around 11% during 2021-2026.
全球晶圓級包裝市場在2015-2020年間經歷了強勁的增長。展望未來，出版商預計該市場在2021-2026年期間將以11%左右的複合年增長率增長。
Companies Mentioned
提到的公司
- Amkor Technology Inc.
- China Wafer Level CSP Co. Ltd.
- Chipbond Technology Corporation
- Deca Technologies Inc. (Infineon Technologies AG)
- Fujitsu Limited
- IQE PLC
- JCET Group Co. Ltd.
- Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
- Tokyo Electron Ltd.
- Toshiba Corporation.
- Amkor Technology Inc.
- 中國晶片級CSP有限公司。
- Chipond科技公司
- 德卡技術公司(DECA Technologies Inc.)
- 富士通有限公司
- IQE PLC
- JCET集團有限公司
- 硅件精密工業有限公司(先進半導體工程公司)
- 東京電子有限公司
- 東芝公司。
The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs). It is used for devices, such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them. This offers various benefits, such as a reduction in the size of the wafer chips, streamlining of the manufacturing processes and improvements in chip functionalities. The ultrathin wafers also provide improved heat dissipation and performance, form factor reduction and minimal power consumption.
晶圓級封裝(WLP)是指用於增加電子連接和集成電路(IC)保護層的封裝解決方案。它用於麥克風、壓力傳感器、加速計、陀螺儀、電容器、電阻器和晶體管等設備。一些常用的WLP集成類型包括扇出(FO)、扇入(FI)、倒裝芯片、3D FOWLP。這些解決方案在設備的晶片級使用，而不是將晶片切成單獨的芯片並進行封裝。這提供了各種好處，例如減小了晶片芯片的尺寸、簡化了製造過程以及改進了芯片功能。超薄晶片還提供了更好的散熱和性能、外形係數降低和最低功耗。
Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors.
全球電子行業的顯著增長是市場增長前景樂觀的關鍵因素之一。此外，對更緊湊、更快的消費電子產品的需求日益增長，也在推動市場增長。這也增加了對高性價比和高性能封裝解決方案的總體需求，以增強設備的機械保護、結構支持和延長電池壽命。此外，各種技術進步，如互聯設備與物聯網(IoT)的集成，也是其他增長誘導因素。
For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further.
例如，WLP被廣泛用於製造自動駕駛汽車的雷達系統。它還用於醫療保健部門，用於生產各種可穿戴設備。其他因素，包括微電子設備電路小型化的增加，以及廣泛的研發(R&D)活動，預計將進一步推動市場。
Key Questions Answered in This Report:
本報告回答的關鍵問題：
- How has the global wafer level packaging market performed so far and how will it perform in the coming years?
- What has been the impact of COVID-19 on the global wafer level packaging market?
- What are the key regional markets?
- What is the breakup of the market based on the packaging type?
- What is the breakup of the market based on the end use industry?
- What are the various stages in the value chain of the industry?
- What are the key driving factors and challenges in the industry?
- What is the structure of the global wafer level packaging market and who are the key players?
- What is the degree of competition in the industry?
- 到目前為止，全球晶圓級封裝市場表現如何，未來幾年將如何表現？
- 新冠肺炎對全球晶圓級封裝市場有何影響？
- 主要的區域市場是什麼？
- 根據包裝類型，市場的細分是什麼？
- 基於最終用途行業的市場細分是什麼？
- 產業價值鏈的各個階段是什麼？
- 行業內的關鍵驅動因素和挑戰是什麼？
- 全球晶圓級封裝市場的結構是什麼？誰是主要參與者？
- 這個行業的競爭程度如何？
Key Topics Covered:
涵蓋的主要主題：
1 Preface
1篇前言
2 Scope and Methodology
2範圍和方法
3 Executive Summary
3執行摘要
4 Introduction
4簡介
4.1 Overview
4.1概述
4.2 Key Industry Trends
4.2主要行業趨勢
5 Global Wafer Level Packaging Market
5全球晶圓級封裝市場
5.1 Market Overview
5.1市場概述
5.2 Market Performance
5.2市場表現
5.3 Impact of COVID-19
5.3.新冠肺炎的影響
5.4 Market Forecast
5.4市場預測
6 Market Breakup by Packaging Technology
6包裝技術細分市場
7 Market Breakup by End Use Industry
7按最終用途行業劃分的市場
8 Market Breakup by Region
8按地區劃分的市場細分
9 SWOT Analysis
9 SWOT分析
10 Value Chain Analysis
10價值鏈分析
11 Porters Five Forces Analysis
11架搬運機的五種受力分析
12 Price Analysis
12價格分析
13 Competitive Landscape
13競爭格局
13.1 Market Structure
13.1市場結構
13.2 Key Players
13.2關鍵角色
13.3 Profiles of Key Players
13.3主要玩家簡介
For more information about this report visit https://www.researchandmarkets.com/r/c9sp8a
有關本報告的更多信息，請訪問https://www.researchandmarkets.com/r/c9sp8a。
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