TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven Ip and 3D-Ic Solutions
台積電和Cadence合作推出人工智能驅動的愛文思控股設計流程、硅驗證的IP和3D-IC解決方案
TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven Ip and 3D-Ic Solutions
台積電和Cadence合作推出人工智能驅動的愛文思控股設計流程、硅驗證的IP和3D-IC解決方案
譯文內容由第三人軟體翻譯。