Micron Technology's advanced packaging facility for high bandwidth memory (HBM) in Singapore broke ground on January 8, marking the first factory of its kind in Singapore. The new factory is planned to start operations in 2026 and will expand Micron's total advanced packaging capacity from 2027 to meet the growing demand for AI. Micron's investment in HBM advanced packaging is approximately 7 billion USD (9.5 billion Singapore dollars), which will create about 1,400 jobs and plans to expand to approximately 3,000 jobs in the future.
美光科技在新加坡投资约70亿美元，扩大先进封装产能
Micron Technology has invested about 7 billion dollars in Singapore to expand advanced packaging capacity.
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