On November 22, Raisecom Technology Development Co., Ltd. (hereinafter referred to as: Raisecom technology) and Peking Hongguang Xiangshang Technology Co., Ltd. (hereinafter referred to as: Hongguang Xiangshang) officially signed a strategic cooperation agreement. The two parties will leverage their respective technological advantages and innovative capabilities to conduct joint product development and deep cooperation in the industry chain around silicon-photonics chip in areas such as DCI datacenter interconnection and the new generation of AI intelligent computing centers, jointly addressing the independent R&D of optical chip technology and miniaturization trends in the domestic optical module market, as well as the geometric increase in global computing power and storage capacity, which is driving a growing demand for ultra-high bandwidth and ultra-low power data transmission.