Shanghai Fortune Techgroup announced that it has signed the "CoWoS-S Heterogeneous Integration Packaging Service Agreement" with Queer Moore for commercial cooperation in the field of CoWoS-S heterogeneous integration. The main content of the agreement includes Party A commissioning Party B to implement the CoWoS-S packaging project, integrate storage, computing, and other core resources, and complete packaging testing and wafer processing at an advanced packaging factory according to Party A's heterogeneous integration design requirements. The delivery time for the first batch of computing chips is March 2025. The smooth implementation of this agreement is expected to have a positive impact on the company's resource integration in new business areas such as AI infrastructure and computing chips. The signing and implementation of this agreement will not have a significant adverse effect on the company's financial condition and business performance.