Resonac - Announces Consortium With US and Japan Companies to Collaborate on Next-Gen Chip Packaging
Resonac宣佈與美國和日本公司成立聯盟,合作開發下一代芯片封裝技術。
Resonac - Announces Consortium With US and Japan Companies to Collaborate on Next-Gen Chip Packaging
Resonac宣佈與美國和日本公司成立聯盟,合作開發下一代芯片封裝技術。
譯文內容由第三人軟體翻譯。