By Heekyong Yang and Fanny Potkin
作者：杨熙京和范妮·波特金
Seoul/Singapore, May 24 (Reuters) - Samsung Electronics' 005930.ks Latest High Bandwidth Memory (Hbm) Chips Have yet to Pass Nvidia's Nvda.o Tests for Use in the U.S. Firm's AI Processors Due to Heat and Power Consumption Problems, Three People Briefed on the Issues Said.
首尔/新加坡5月24日电（路透社）——三星电子的 005930.ks 最新的高带宽内存（Hbm）芯片尚未通过Nvidia的芯片 nvda.o 三位听取问题通报的人士说，由于散热和功耗问题，在美国公司的AI处理器中使用的测试。
The Problems Affect Samsung's Hbm3 Chips, Which Are the Fourth-Generation Hbm Standard Currently Most Used in Graphics Processing Units (Gpus) for Artificial Intelligence, as Well as Fifth-Generation Hbm3E Chips That the South Korean Tech Giant and Its Rivals Are Bringing to Market This Year, They Said.
他们说，这些问题影响了三星的Hbm3芯片，这是目前最常用于人工智能图形处理单元（GPU）的第四代Hbm标准，以及这家韩国科技巨头及其竞争对手今年推向市场的第五代Hbm3E芯片。
The Reasons for Samsung Failing Nvidia's Tests Are Being Reported for the First Time.
三星未能通过Nvidia测试的原因首次被报道。
Samsung Said in a Statement to Reuters That Hbm Is a Customized Memory Product Requiring "Optimization Processes in Tandem With Customers' Needs," Adding That It Is in the Process of Optimizing Its Products Through Close Collaboration With Customers. It Declined to Comment on Specific Customers.
三星在给路透社的一份声明中表示，Hbm是一款定制的存储器产品，需要 “根据客户需求进行优化流程”，并补充说，它正在通过与客户的密切合作来优化其产品。它拒绝对特定客户发表评论。
Nvidia Declined to Comment.
英伟达拒绝置评。
Hbm - a Type of Dynamic Random Access Memory or Dram Standard First Produced in 2013 in Which Chips Are Vertically Stacked to Save Space and Reduce Power Consumption - Helps Process Massive Amounts of Data Produced by Complex AI Applications. as Demand for Sophisticated Gpus Has Soared Amid the Generative AI Boom, so Has Demand for Hbm.
Hbm是2013年首次生产的一种动态随机存取存储器或DRAM标准，其中芯片垂直堆叠以节省空间并降低功耗，可帮助处理复杂的人工智能应用程序产生的大量数据。随着生成式人工智能热潮中对复杂GPU的需求激增，对Hbm的需求也随之飙升。
Satisfying Nvidia - Which Commands Around 80% of the Global GPU Market for AI Applications - Is Seen as Key to Future Growth for Hbm Manufacturers - Both Reputationally and in Terms of Profit Momentum.
无论是在声誉还是利润势头方面，Nvidia都被视为Hbm制造商未来增长的关键，Nvidia在全球人工智能应用GPU市场中占有约80％的份额。
Samsung Has Been Trying to Pass Nvidia's Tests for Hbm3 and Hbm3E Since Last Year, the Three Sources Said. According to Two of the People, the Results of a Recent Failed Test for Samsung's 8-Layer and 12-Layer Hbm3E Chips Came in April.
三位消息人士称，自去年以来，三星一直在努力通过英伟达对Hbm3和Hbm3E的测试。据其中两位人士称，最近对三星8层和12层Hbm3E芯片的测试失败的结果是在4月发布的。
It Was Not Immediately Clear IF the Problems Can Be Easily Addressed, but the Three Sources Said That the Failures to Meet Nvidia's Requirements Have Increased Concerns in the Industry and Among Investors That Samsung Could Fall Further Behind Rivals SK Hynix 000660.ks and Micron Technology Mu.o in Hbm.
目前尚不清楚这些问题是否可以轻松解决，但三位消息人士表示，未能满足Nvidia的要求加剧了业内和投资者对三星可能进一步落后于竞争对手SK Hynix的担忧 000660.ks 和美光科技 Muo。 在 Hbm 中。
The Sources, Two of Whom Were Briefed on the Matter by Samsung Officials, Spoke on Condition of Anonymity as the Information Was Confidential.
消息人士在不愿透露姓名的情况下讲话，其中两人听取了三星官员的通报，因为信息是机密的。
New Chip Unit Head
新芯片单元负责人
In Contrast to Samsung, Domestic Rival SK Hynix Is the Main Supplier of Hbm Chips to Nvidia and Has Been Supplying Hbm3 Since June 2022. It Also Began Supplying Hbm3E in Late March to a Customer It Declined to Identify. Shipments Went to Nvidia, Sources Have Said.
与三星相比，国内竞争对手海力士是英伟达Hbm芯片的主要供应商，自2022年6月以来一直在供应Hbm3。它还于3月下旬开始向拒绝透露身份的客户供应Hbm3E。消息人士称，向英伟达发货。
Micron, the Only Other Major Manufacturer of Hbm, Has Also Said It Will Supply Nvidia With Hbm3E.
Hbm的唯一其他主要制造商美光也表示将向英伟达提供Hbm3E。
In a Move That Analysts Said Appeared to Underscore Samsung's Concerns About Its Laggard Position in Hbm, Samsung This Week Replaced the Head of Its Semiconductor Unit Saying a New Person at the Top Was Needed to Navigate What It Called a "Crisis" Affecting the Industry.
分析师表示，此举似乎凸显了三星对其在Hbm的落后地位的担忧，三星本周 已更换 其半导体部门负责人表示，需要一位新的高层人士来应对影响该行业的所谓的 “危机”。
Market Expectations Have Been High That Samsung, as the World's Biggest Maker of Memory Chips, Would Quickly Pass Nvidia's Tests, but It's Also Natural That Specialised Products Like Hbm Will Take Some Time to Meet Customers' Performance Evaluations, Said Jeff Kim, Head of Research at KB Securities.
KB Securities研究主管杰夫·金表示，市场对作为全球最大的存储芯片制造商的三星将很快通过Nvidia的测试寄予厚望，但像Hbm这样的专业产品自然需要一些时间才能达到客户的性能评估。
Although Samsung Has yet to Become a Supplier of Hbm3 to Nvidia, It Does Supply Customers Such as Advanced Micro Devices Amd.o (AMD) and Is Aiming to Begin Mass Production of Hbm3E Chips in the Second Quarter. Samsung Said in Its Statement to Reuters That Its Product Schedule Is Proceeding as Planned.
尽管三星尚未成为Nvidia的Hbm3供应商，但它确实为高级微设备等客户提供服务 AMD.o (AMD) 并计划在第二季度开始批量生产Hbm3E芯片。三星在给路透社的声明中表示，其产品计划正在按计划进行。
Analysts Also Say That SK Hynix, Which Developed the First Hbm Chip in 2013, Has Spent Far More Time and Resources on Hbm Research and Development Than Samsung Over the Past Decade, Accounting for Its Technological Edge.
分析人士还表示，SK海力士于2013年开发了第一款Hbm芯片，在过去十年中，在Hbm研发上花费的时间和资源远远超过三星，这是其技术优势的原因。
Samsung Said in Its Statement That It Developed the First Commercial Hbm Solution for High-Performance Computing in 2015 and Has Continued to Invest in Hbm Since Then.
三星在声明中表示，它于2015年开发了第一款用于高性能计算的商用Hbm解决方案，此后一直在投资Hbm。
GPU Manufacturers Like Nvidia and AMD Are Keen for Samsung to Perfect Its Hbm Chips so They Can Have More Vendor Options and Weaken SK Hynix's Pricing Power, the Sources Also Said.
消息人士还称，Nvidia和AMD等GPU制造商渴望三星完善其Hbm芯片，以便他们有更多的供应商选择并削弱SK海力士的定价能力。
At an Nvidia AI Conference in March, Nvidia CEO Jensen Huang Signed a Placard at Samsung's Booth That Said "Jensen Approved" for Samsung's 12-Layer Hbm3E - Underscoring the Company's Enthusiasm About the Prospect of Samsung Supplying Those Chips.
在三月份的英伟达人工智能会议上，英伟达首席执行官黄延森在三星展位上签署了一张标语牌，上面写着三星的12层Hbm3E获得 “詹森批准”，这凸显了该公司对三星供应这些芯片前景的热情。
Hbm3E Chips Are Likely to Become the Mainstream Hbm Product in the Market This Year With Shipments Concentrated in the Second Half of 2024, According to Research Firm Trendforce.
根据研究公司Trendforce的数据，Hbm3E芯片可能会成为今年市场上的主流Hbm产品，出货量集中在2024年下半年。
Separately, SK Hynix Estimates That Demand for Hbm Memory Chips in General Could Increase at an Annual Rate of 82% Through 2027.
另外，SK海力士估计，到2027年，对Hbm存储芯片的需求总体上可能以82％的年增长率增长。
Analysts Have Said That Samsung's Relatively Weak Position in Hbm Has Been Noticed by Investors. Its Shares Are Flat for the Year to Date, While SK Hynix's Stock Is up 41% and Micron's Shares Are up 48%.
分析师表示，投资者已经注意到三星在Hbm中的相对较弱的地位。今年迄今为止，其股价持平，而SK海力士的股票上涨了41％，美光的股价上涨了48％。
($1 = 1,362.8600 Won)
（$1 = 1,362.8600 韩元）
(Reporting by Heekyong Yang in Seoul and Fanny Potkin in Singapore; Additional Reporting by Ju-Min Park in Seoul and Max a. Cherney in San Francisco; Editing by Josh Smith and Edwina Gibbs)
（首尔的杨熙京和新加坡的范妮·波特金的报道；首尔的朴菊敏和旧金山的马克斯·切尔尼的补充报道；乔什·史密斯和埃德温娜·吉布斯编辑）