By Heekyong Yang and Fanny Potkin
作者：楊熙京和範妮·波特金
Seoul/Singapore, May 24 (Reuters) - Samsung Electronics' 005930.ks Latest High Bandwidth Memory (Hbm) Chips Have yet to Pass Nvidia's Nvda.o Tests for Use in the U.S. Firm's AI Processors Due to Heat and Power Consumption Problems, Three People Briefed on the Issues Said.
首爾/新加坡5月24日電（路透社）——三星電子的 005930.ks 最新的高帶寬內存（Hbm）芯片尚未通過Nvidia的芯片 nvda.o 三位聽取問題通報的人士說，由於散熱和功耗問題，在美國公司的AI處理器中使用的測試。
The Problems Affect Samsung's Hbm3 Chips, Which Are the Fourth-Generation Hbm Standard Currently Most Used in Graphics Processing Units (Gpus) for Artificial Intelligence, as Well as Fifth-Generation Hbm3E Chips That the South Korean Tech Giant and Its Rivals Are Bringing to Market This Year, They Said.
他們說，這些問題影響了三星的Hbm3芯片，這是目前最常用於人工智能圖形處理單元（GPU）的第四代Hbm標準，以及這家韓國科技巨頭及其競爭對手今年推向市場的第五代Hbm3E芯片。
The Reasons for Samsung Failing Nvidia's Tests Are Being Reported for the First Time.
三星未能通過Nvidia測試的原因首次被報道。
Samsung Said in a Statement to Reuters That Hbm Is a Customized Memory Product Requiring "Optimization Processes in Tandem With Customers' Needs," Adding That It Is in the Process of Optimizing Its Products Through Close Collaboration With Customers. It Declined to Comment on Specific Customers.
三星在給路透社的一份聲明中表示，Hbm是一款定製的存儲器產品，需要 “根據客戶需求進行優化流程”，並補充說，它正在通過與客戶的密切合作來優化其產品。它拒絕對特定客戶發表評論。
Nvidia Declined to Comment.
英偉達拒絕置評。
Hbm - a Type of Dynamic Random Access Memory or Dram Standard First Produced in 2013 in Which Chips Are Vertically Stacked to Save Space and Reduce Power Consumption - Helps Process Massive Amounts of Data Produced by Complex AI Applications. as Demand for Sophisticated Gpus Has Soared Amid the Generative AI Boom, so Has Demand for Hbm.
Hbm是2013年首次生產的一種動態隨機存取存儲器或DRAM標準，其中芯片垂直堆疊以節省空間並降低功耗，可幫助處理複雜的人工智能應用程序產生的大量數據。隨着生成式人工智能熱潮中對複雜GPU的需求激增，對Hbm的需求也隨之飆升。
Satisfying Nvidia - Which Commands Around 80% of the Global GPU Market for AI Applications - Is Seen as Key to Future Growth for Hbm Manufacturers - Both Reputationally and in Terms of Profit Momentum.
無論是在聲譽還是利潤勢頭方面，Nvidia都被視爲Hbm製造商未來增長的關鍵，Nvidia在全球人工智能應用GPU市場中佔有約80％的份額。
Samsung Has Been Trying to Pass Nvidia's Tests for Hbm3 and Hbm3E Since Last Year, the Three Sources Said. According to Two of the People, the Results of a Recent Failed Test for Samsung's 8-Layer and 12-Layer Hbm3E Chips Came in April.
三位消息人士稱，自去年以來，三星一直在努力通過英偉達對Hbm3和Hbm3E的測試。據其中兩位人士稱，最近對三星8層和12層Hbm3E芯片的測試失敗的結果是在4月發佈的。
It Was Not Immediately Clear IF the Problems Can Be Easily Addressed, but the Three Sources Said That the Failures to Meet Nvidia's Requirements Have Increased Concerns in the Industry and Among Investors That Samsung Could Fall Further Behind Rivals SK Hynix 000660.ks and Micron Technology Mu.o in Hbm.
目前尚不清楚這些問題是否可以輕鬆解決，但三位消息人士表示，未能滿足Nvidia的要求加劇了業內和投資者對三星可能進一步落後於競爭對手SK Hynix的擔憂 000660.ks 和美光科技 Muo。 在 Hbm 中。
The Sources, Two of Whom Were Briefed on the Matter by Samsung Officials, Spoke on Condition of Anonymity as the Information Was Confidential.
消息人士在不願透露姓名的情況下講話，其中兩人聽取了三星官員的通報，因爲信息是機密的。
New Chip Unit Head
新芯片單元負責人
In Contrast to Samsung, Domestic Rival SK Hynix Is the Main Supplier of Hbm Chips to Nvidia and Has Been Supplying Hbm3 Since June 2022. It Also Began Supplying Hbm3E in Late March to a Customer It Declined to Identify. Shipments Went to Nvidia, Sources Have Said.
與三星相比，國內競爭對手海力士是英偉達Hbm芯片的主要供應商，自2022年6月以來一直在供應Hbm3。它還於3月下旬開始向拒絕透露身份的客戶供應Hbm3E。消息人士稱，向英偉達發貨。
Micron, the Only Other Major Manufacturer of Hbm, Has Also Said It Will Supply Nvidia With Hbm3E.
Hbm的唯一其他主要製造商美光也表示將向英偉達提供Hbm3E。
In a Move That Analysts Said Appeared to Underscore Samsung's Concerns About Its Laggard Position in Hbm, Samsung This Week Replaced the Head of Its Semiconductor Unit Saying a New Person at the Top Was Needed to Navigate What It Called a "Crisis" Affecting the Industry.
分析師表示，此舉似乎凸顯了三星對其在Hbm的落後地位的擔憂，三星本週 已更換 其半導體部門負責人表示，需要一位新的高層人士來應對影響該行業的所謂的 “危機”。
Market Expectations Have Been High That Samsung, as the World's Biggest Maker of Memory Chips, Would Quickly Pass Nvidia's Tests, but It's Also Natural That Specialised Products Like Hbm Will Take Some Time to Meet Customers' Performance Evaluations, Said Jeff Kim, Head of Research at KB Securities.
KB Securities研究主管傑夫·金表示，市場對作爲全球最大的存儲芯片製造商的三星將很快通過Nvidia的測試寄予厚望，但像Hbm這樣的專業產品自然需要一些時間才能達到客戶的性能評估。
Although Samsung Has yet to Become a Supplier of Hbm3 to Nvidia, It Does Supply Customers Such as Advanced Micro Devices Amd.o (AMD) and Is Aiming to Begin Mass Production of Hbm3E Chips in the Second Quarter. Samsung Said in Its Statement to Reuters That Its Product Schedule Is Proceeding as Planned.
儘管三星尚未成爲Nvidia的Hbm3供應商，但它確實爲高級微設備等客戶提供服務 AMD.o (AMD) 並計劃在第二季度開始批量生產Hbm3E芯片。三星在給路透社的聲明中表示，其產品計劃正在按計劃進行。
Analysts Also Say That SK Hynix, Which Developed the First Hbm Chip in 2013, Has Spent Far More Time and Resources on Hbm Research and Development Than Samsung Over the Past Decade, Accounting for Its Technological Edge.
分析人士還表示，SK海力士於2013年開發了第一款Hbm芯片，在過去十年中，在Hbm研發上花費的時間和資源遠遠超過三星，這是其技術優勢的原因。
Samsung Said in Its Statement That It Developed the First Commercial Hbm Solution for High-Performance Computing in 2015 and Has Continued to Invest in Hbm Since Then.
三星在聲明中表示，它於2015年開發了第一款用於高性能計算的商用Hbm解決方案，此後一直在投資Hbm。
GPU Manufacturers Like Nvidia and AMD Are Keen for Samsung to Perfect Its Hbm Chips so They Can Have More Vendor Options and Weaken SK Hynix's Pricing Power, the Sources Also Said.
消息人士還稱，Nvidia和AMD等GPU製造商渴望三星完善其Hbm芯片，以便他們有更多的供應商選擇並削弱SK海力士的定價能力。
At an Nvidia AI Conference in March, Nvidia CEO Jensen Huang Signed a Placard at Samsung's Booth That Said "Jensen Approved" for Samsung's 12-Layer Hbm3E - Underscoring the Company's Enthusiasm About the Prospect of Samsung Supplying Those Chips.
在三月份的英偉達人工智能會議上，英偉達首席執行官黃延森在三星展位上籤署了一張標語牌，上面寫着三星的12層Hbm3E獲得 “詹森批准”，這凸顯了該公司對三星供應這些芯片前景的熱情。
Hbm3E Chips Are Likely to Become the Mainstream Hbm Product in the Market This Year With Shipments Concentrated in the Second Half of 2024, According to Research Firm Trendforce.
根據研究公司Trendforce的數據，Hbm3E芯片可能會成爲今年市場上的主流Hbm產品，出貨量集中在2024年下半年。
Separately, SK Hynix Estimates That Demand for Hbm Memory Chips in General Could Increase at an Annual Rate of 82% Through 2027.
另外，SK海力士估計，到2027年，對Hbm存儲芯片的需求總體上可能以82％的年增長率增長。
Analysts Have Said That Samsung's Relatively Weak Position in Hbm Has Been Noticed by Investors. Its Shares Are Flat for the Year to Date, While SK Hynix's Stock Is up 41% and Micron's Shares Are up 48%.
分析師表示，投資者已經注意到三星在Hbm中的相對較弱的地位。今年迄今爲止，其股價持平，而SK海力士的股票上漲了41％，美光的股價上漲了48％。
($1 = 1,362.8600 Won)
（$1 = 1,362.8600 韓元）
(Reporting by Heekyong Yang in Seoul and Fanny Potkin in Singapore; Additional Reporting by Ju-Min Park in Seoul and Max a. Cherney in San Francisco; Editing by Josh Smith and Edwina Gibbs)
（首爾的楊熙京和新加坡的範妮·波特金的報道；首爾的樸菊敏和舊金山的馬克斯·切爾尼的補充報道；喬什·史密斯和埃德溫娜·吉布斯編輯）