By David Shepardson
作者：大衛·謝潑德森
Washington, May 23 (Reuters) - The US Commerce Department Said on Thursday It Plans to Grant $75 Million to Absolics for Constructing a 120,000-Square-Foot Facility in Georgia That Will Supply Advanced Materials to the Country's Semiconductor Industry.
華盛頓，5月23日（路透社）— 美國商務部週四表示，計劃向Absolics撥款7500萬美元，用於在格魯吉亞建造一座佔地12萬平方英尺的設施，該設施將爲該國的半導體行業提供先進材料。
The Planned Award to the Semiconductor Packaging Provider, an Affliate of Skc Co, Which in Turn Is Part of South Korea's Second-Largest Conglomerate SK Group 034730.ks, Is to Come From the U.S. Government's $52.7 Billion U.S. Semiconductor Chips Manufacturing and Subsidy Fund.
計劃將獎勵給這家半導體封裝提供商，該公司是Skc的子公司，而Skc又是韓國第二大企業集團SK集團的一部分 034730.ks，將來自美國政府的527億美元美國半導體芯片 製造和補貼基金。
The Funds Will Develop Technology for Advanced Packaging, Marking the First Commercial Facility to Support the Semiconductor Supply Chain With a New Advanced Material.
這些資金將開發先進封裝技術，標誌着第一個使用新的先進材料支持半導體供應鏈的商業設施。
The Commerce Department Said the Award Will Also Support 1,000 Construction Jobs and 200 Manufacturing and R&D Jobs in Covington, Georgia.
美國商務部表示，該獎項還將支持佐治亞州卡溫頓的1,000個建築業工作崗位和200個製造業和研發工作崗位。
Absolics’ Glass Substrate Allows for Processing and Memory Chips to Be Packed Into a Single Device Allowing for Faster, MOre Efficient Computing.
Absolics的玻璃基板允許將處理和存儲芯片封裝到單個設備中，從而實現更快、更高效的計算。
The Company, Which Was Created in 2021, Broke Ground on the Georgia Plant in November 2022. Applied Materials Amat.o Is an Investor.
該公司成立於2021年，於2022年11月在佐治亞州的工廠破土動工。應用材料 Amat.o 是投資者。
CEO Jun Rok Oh Said in a Statement the Proposed Funding Will Allow the Company "to Fully Commercialize Our Pioneering Glass Substrate Technology for Use in High-Performance Computing and Cutting-Edge Defense Applications."
首席執行官吳俊洛在一份聲明中表示，擬議的資金將使該公司 “能夠將我們的開創性玻璃基板技術完全商業化，用於高性能計算和尖端國防應用”。
The Commerce Department Said Glass Substrates From Absolics Will Be Used to Boost Performance of Leading-Edge Chips for AI and Data Centers.
美國商務部表示，來自Absolics的玻璃基板將用於提高人工智能和數據中心前沿芯片的性能。
Last Month, SK Hynix 000660.ks, The World's Second-Largest Memory Chip Maker, Said It Would Invest $3.87 Billion to Build an Advanced Packaging Plant and R&D Facility for AI Products in Indiana.
上個月，SK 海力士 000660.ks, 全球第二大存儲芯片製造商， 表示將投資38.7億美元在印第安納州建造先進的封裝工廠和人工智能產品研發設施。
U.S. Commerce Secretary Gina Raimondo, Who Previously Noted the Advanced Packaging Substrates Market Is Currently Concentrated in Asia, Has Made Advanced Packaging a Priority and Said Last Year "the U.S. Will Develop Multiple High-Volume Advanced Packaging Facilities."
美國商務部長吉娜·雷蒙多（Gina Raimondo）此前曾指出，先進封裝基材市場目前集中在亞洲，她已將先進封裝作爲優先事項，並於去年表示 “美國將開發多個大批量的先進封裝設施。”
In November, the Commerce Department Disclosed Details of Its Plans to Spend $3 Billion in Support of Advanced Packaging.
11月，美國商務部披露了其計劃花費30億美元支持先進包裝的細節。
The Same Month, Amkor Technology Amkr.o Said It Would Spend $2 Billion to Build a New Advanced Packaging and Test Facility in Arizona That Will Package and Test Chips for Apple Aapl.o Produced at a Nearby Taiwanese Chipmaker TSMC 2330.tw Facility.
同月，Amkor Technology AMKRO 說要花 $20億美元用於建造新的高級封裝 以及位於亞利桑那州的測試設施，將爲蘋果封裝和測試芯片 aapl.o 由附近的臺灣芯片製造商台積電製作 2330.tw 設施。
That Department Recently Announced Several Major Proposed Awards From the Chips Program Including $8.5 Billion in Grants for Intel Intc.o, $6.6 Billion for TSMC, $6.4 Billion for South Korea's Samsung 005930.ks and $6.1 Billion for Memory Chip Maker Micron Technology Mu.o.
該部門最近宣佈了芯片計劃的幾項主要擬議獎項，包括向英特爾提供的85億美元補助金 intc.o，台積電爲66億美元，韓國三星爲64億美元 005930.ks 以及存儲芯片製造商美光科技的61億美元 Muo。。
(Reporting by David Shepardson; Editing by Nivedita Bhattacharjee)
（大衛·謝潑德森報道；Nivedita Bhattacharjee 編輯）
((David.shepardson@Thomsonreuters.com; 2028988324;))
((David.shepardson@Thomsonreuters.com; 2028988324;))