Wang Shi, co-general manager of UMC, said that UMC will continue to actively strengthen special processes. The 3DIC solution has been adopted by customers. The first application was an RF front-end module, which is expected to be mass-produced this year. UMC will not only see significant market share growth in the RFSOI special process, but will also continue to develop customers in the embedded high voltage process. UMC is also actively developing the field of advanced packaging. In addition to providing an interposer (interposer) for 2.5D packaging, it also supplies WoW Hybrid Bonding (hybrid bonding) technology. The first case was an existing customer using its own RFSOI process. It is actively expanding related production capacity this year, and mass production is expected this year. (Science and Technology Innovation Board Daily)
联电：3DIC解决方案已获得客户采用 预计今年就会量产
UMC: The 3DIC solution has been adopted by customers and is expected to be mass-produced this year
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