鼎龙股份:公司封装用光刻胶(PSPI)目前已开始客户送样工作
Dinglong Co., Ltd.: The company's packaging photoresist (PSPI) has now begun to send samples to customers
鼎龙股份在互动平台表示,公司在先进封装材料领域重点布局的产品包括:临时键合胶(TBA),封装光刻胶PSPI,底部填充剂(Underfill)等产品。公司显示用光刻胶(PSPI)已经通过主流显示客户验证,正在逐步放量。公司封装用光刻胶(PSPI),在显示用PSPI的技术平台基础上,吸收了PI合成及产业化方面的技术经验,目前已经开始客户送样工作。
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