Jingfang Technology announced that the “MEMS Sensor Chip Advanced Packaging Test Platform” project declared by the company as the lead undertaker was approved by the High-Tech Research and Development Center of the Ministry of Science and Technology of China.
晶方科技：“MEMS传感器芯片先进封装测试平台”项目获得立项批复
Jingfang Technology: “Advanced Packaging Test Platform for MEMS Sensor Chips” project received approval
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The above content is for informational or educational purposes only and does not constitute any investment advice related to Futu. Although we strive to ensure the truthfulness, accuracy, and originality of all such content, we cannot guarantee it.
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The above content is for informational or educational purposes only and does not constitute any investment advice related to Futu. Although we strive to ensure the truthfulness, accuracy, and originality of all such content, we cannot guarantee it.
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