According to foreign media reports, after the large-scale production of the 5nm process, the next major chip process process that Taiwan Semiconductor Manufacturing Co Ltd will put into production will be 3nm, which is currently being promoted as planned, with plans to start risk trial production in 2021 and large-scale production in the second half of 2022.

Although it is nearly two years before Taiwan Semiconductor Manufacturing Co Ltd 3nm process is put into large-scale production, many manufacturers are paying attention to Taiwan Semiconductor Manufacturing Co Ltd's advanced process technology.

Foreign media reports show that Taiwan Semiconductor Manufacturing Co Ltd 3nm process prepared 4 waves of production capacity, of which most of the first wave of production capacity will be left to their big customer Apple Inc.

Most of the production capacity of Taiwan Semiconductor Manufacturing Co Ltd's 3nm process is left to Apple Inc, which is to be expected. Apple Inc is a big customer of Taiwan Semiconductor Manufacturing Co Ltd. Since the A10 processors installed in the iPhone 7 series in 2016, all Apple Inc's A series processors have been exclusively manufactured by Taiwan Semiconductor Manufacturing Co Ltd. TSMC has today's scale, thanks to Apple Inc's large orders in addition to their leading technology.

3nm process is a complete process node leapfrogging after 5nm, which will significantly improve the performance of the chip. At the meetings of financial analysts in the first and second quarters of this year, Taiwan Semiconductor Manufacturing Co Ltd CEO Wei Zhijia talked about the 3nm process, revealing that compared with the 5nm process, the 3nm process will increase the density of transistors by 70%, chip speed by 10% to 15%, and energy efficiency by 25% to 30%.