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台积电3nm工艺要获得Intel订单:未来月产能提升至10万片晶圆

快科技 ·  Sep 28, 2020 12:18

ForIntelFor example, they are passively lagging behind AMD in this wave. Although many factors determine this, the less advanced process is definitely one of them.

According to the latest foreign media reports,Intel, which is considering OEM chips from other manufacturers, has already handed over OEM orders for 180,000 wafer GPUs in 2021TSMC, the latter 6nm process will be used.

In addition to contract orders for 180,000 GPUs, TSMC's 3nm process, which has not yet been put into production, will also receive orders from Intel.

After the 5nm process is put into large-scale production, the next major chip process that TSMC will put into production will be 3nm. It is currently progressing according to plan. It plans to begin risk trial production in 2021 and large-scale production in the second half of 2022.

It is reported that TSMC's 3nm process has prepared 4 waves of production capacity, and most of the first wave of production capacity will be reserved for major customersapplesThe next 3 waves of production capacity will also be booked by many manufacturers, including Intel.

TSMC is currently advancing the 3nm process into large-scale production in the second half of 2022 as planned, with a set production capacity of 55,000 wafers per month. However, people familiar with the matter also revealed that 55,000 pieces is the monthly production capacity at the beginning of production, then it will gradually increase, and the monthly production capacity will increase to 100,000 wafers in 2023.

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The translation is provided by third-party software.


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