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拜登任期终结前忙敲定芯片法案协议 惠普(HPQ.US)获5300万美元直接融资

Before the end of Biden's term, efforts are being made to finalize the chip bill agreement, and HP Inc (HPQ.US) received $53 million in direct financing.

Zhitong Finance ·  Jan 13 12:53

As part of the USA CHIPS Act, HP Inc (HPQ.US) has won up to 53 million USD in direct funding to support next-generation technologies and the domestic manufacturing of the "lab-to-fab" ecosystem.

According to Zhichun Finance APP, as part of the USA Chips Act (CHIPS), HP Inc (HPQ.US) has secured up to $53 million in direct financing to support next-generation technologies and the "lab-to-fab" ecosystem for domestic manufacturing.

This funding is finalized based on the commercial manufacturing facilities financing opportunities under the CHIPS reward program and will support the expansion and modernization of the existing facility in Corvallis, Oregon, which is part of the "lab-to-fab" ecosystem transitioning from R&D activities to commercial manufacturing.

Previously, both parties announced the signing of a preliminary term sheet last August. The department will disburse funds based on HP's completion of project milestones.

US Secretary of Commerce Gina Raimondo stated, "The technologies being developed by companies like HP will bring unprecedented breakthroughs for future generations." "By investing in companies and R&D projects within the semiconductor ecosystem, the Biden-Harris administration is helping to build and ensure domestic semiconductor capability, which will help the USA continue to outpace other parts of the world in competition and innovation."

Among Other Products, CHIPS funding will support the manufacturing of key components of silicon equipment for life science laboratory equipment, which are used in drug discovery, single-cell research, and cell line development.

The Biden administration is rushing to finalize these agreements before President Trump potentially returns to the White House. The Department of Commerce has announced preliminary agreements with over 20 companies and has finalized agreements with several, including Taiwan Semiconductor (TSM.US), Intel (INTC.US), GlobalFoundries (GFS.US), Entegris (ENTG.US), and Micron Technology (MU.US).

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