美光公司总裁兼首席执行官Sanjay Mehrotra表示：“随着人工智能在各行各业的普及，对先进内存和存储解决方案的需求将继续强劲增长。”“在新加坡政府的持续支持下，我们对这家HBM先进封装设施的投资加强了我们的地位，以应对未来不断扩大的人工智能机会。”Micron Technology (MU.US) announced on Wednesday that a new advanced packaging factory for high bandwidth memory (HBM) will break ground near its existing facility in Singapore.
According to Zhitong Finance APP, Micron Technology (MU.US) announced on Wednesday that construction will begin on a new high bandwidth memory (HBM) advanced packaging factory near its existing facility in Singapore. This American tech giant stated that the factory is planned to start operations in 2026, and to meet the growing demands of AI, Micron will begin large-scale expansion of advanced packaging capacity from 2027.
Png Cheong Boon, Chairman of the Singapore Economic Development Board, stated that this is Singapore's first HBM advanced packaging facility.
Sanjay Mehrotra, President and CEO of Micron, stated, "As AI becomes more prevalent across various industries, the demand for advanced memory and storage solutions will continue to grow strongly." He added, "With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to seize the expanding AI opportunities in the future."
The company noted that by the end of this decade, its HBM advanced packaging investment will be approximately 7 billion USD (equivalent to 9.5 billion Singapore dollars), initially creating about 1,400 jobs, which is expected to reach 3,000 jobs as future factory expansion plans advance. New functions will include packaging development, assembly, and testing operations. The company pointed out that the facility will strengthen the local semiconductor ecosystem and innovation in Singapore.
Additionally, Micron stated that its future expansion plans in Singapore will also support the long-term manufacturing needs of NAND (a storage technology). Micron added that it will remain flexible in managing the growth of HBM and NAND facility capacities to adapt to market demands.
The HBM market is dominated by South Korean companies SK Hynix and Samsung Electronics, with Micron holding a smaller market share. HBM chips are key components used in graphics processing units (GPUs) for AI applications, with companies such as NVIDIA (NVDA.US) utilizing them.
Earlier on Wednesday, Samsung announced its preliminary operating profit forecast for the fourth quarter of 2024, expected to be around 6.5 trillion won (approximately 4.47 billion USD), which is lower than Analyst expectations. However, it was reported that the company did not provide any updates on supplying HBM chips to NVIDIA.