Gelonghui, January 8丨 TongFu Microelectronics (002156.SZ) stated on the investor interaction platform that the company has testing and packaging projects involving the MI series products.
通富微电(002156.SZ)：有涉及MI系列产品的封测项目
TongFu Microelectronics (002156.SZ): Involved in packaging and testing projects for the MI series products.
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