On December 31, Gelonghui reported that Will Semiconductor (603501.SH) announced that the public issuance of Convertible Bonds for the "Wafer Color Filter and Micro Lens Packaging Project" has been completed and reached the expected usable status. After the completion of the "Wafer Color Filter and Micro Lens Packaging Project," all of the company's Convertible Bonds fundraising projects have been fully implemented and completed.

As of December 30, 2024, the total unused funds raised by the company's Convertible Bonds fundraising projects amount to 380.3644 million yuan (including interest income, actual amount is subject to the balance of the special account on the day of fund transfer), accounting for 15.93% of the net amount raised this time. The company plans to permanently supplement the above unused raised funds into working capital.