On December 27, Gelonghui reported that Huagong Tech (000988.SZ) stated on the investor interactive platform that the company is committed to providing comprehensive "Laser + Intelligent Manufacturing" solutions for the 3C electronics, automotive electronics, New energy Fund, PCB microelectronics, compound Semiconductors, and Consumer goods industries. In the fields of Semiconductors and advanced packaging, the company has launched wafer laser cutting equipment, wafer measurement equipment, as well as wafer laser annealing intelligent equipment, and fully automatic wafer laser modification cutting intelligent equipment. These are primarily used for power and RF devices/chips of SiC and GaN, and are widely applied in Smart Automobile, photovoltaics, 5G communication, and other areas.