On December 27, Gelonghui reported that Weiteou (301319.SZ) mentioned on the investor interaction platform that the company's microelectronic soldering materials, such as solder paste and solder wire, can be used in semiconductor soldering and chip packaging processes.
唯特偶(301319.SZ)：微电子焊接材料如锡膏、锡线等均可应用到半导体焊接和芯片封装工艺制程中
Weiteou (301319.SZ): Microelectronic soldering materials such as solder paste, solder wire, etc., can be applied in Semiconductors soldering and chip packaging processes.
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