On December 19, Gloriunion reported that Qi Zhong Technology recently stated during an institutional research reception that current power management chips in the fields of industrial control, Autos electronics, and network communication mainly use traditional packaging, including DIP, BGA, QFP/PFP, and SO packaging forms. However, as downstream terminal demands continue to upgrade, especially for consumer electronics as representatives, the requirements for stability, power consumption, and chip size of power management are higher. Power management chip packaging technology is gradually transitioning from traditional packaging to advanced packaging, specifically including forms such as FC, WLCSPSiP, and 3D packaging.