Shennan Circuits (002916.SZ): Currently has the mass production capacity for BT class packaging substrates, covering all forms of WB and FC packaging.

Gelonghui Finance · Dec 17, 2024 07:14

On December 17th, Gelonghui reported that Shennan Circuits (002916.SZ) recently stated in an investor relations activity that the company's packaging substrate products cover a wide variety, including module-type packaging substrates, storage-type packaging substrates, and application processor chip packaging substrates, primarily used in mobile smart terminals, Server/storage, and other fields. The company currently has the mass production capacity for BT-type packaging substrates, covering all forms of WB and FC packaging. On the other hand, for FC-BGA packaging substrate products, through continuous technological research and development work in recent years, the company has achieved breakthroughs in technical capabilities for some products, with progress made in client certification and capacity construction. Currently, the company has become the largest domestic supplier of packaging substrates.

The translation is provided by third-party software.

The above content is for informational or educational purposes only and does not constitute any investment advice related to Futu. Although we strive to ensure the truthfulness, accuracy, and originality of all such content, we cannot guarantee it.

深南电路(002916.SZ)：目前已具备包括WB、FC封装形式全覆盖的BT类封装基板量产能力

Shennan Circuits (002916.SZ): Currently has the mass production capacity for BT class packaging substrates, covering all forms of WB and FC packaging.

Risk Disclaimer

Statement