Gelonghui reported on December 16 that China Wafer Level CSP (603005.SH) stated on the investor interaction platform that the company's packaged products include image sensor chips (CIS), biometric identification chips, MEMS chips, RF chips, and others. These products are currently widely used in Smart Phones, security monitoring digital devices in IoT, automotive electronics, AR/VR, and other terminal markets. The AI field is also one of the important future application scenarios for related chips.
晶方科技(603005.SH)：AI领域也是相关芯片未来重要应用场景之一
China Wafer Level CSP (603005.SH): The AI field is also one of the important application scenarios for relevant chips in the future.
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