According to the Zhitong Finance APP, on Friday, Taiwan Semiconductor (TSM.US) rose over 3% in pre-market trading, reaching $197.34. In terms of news, industry insiders revealed that Taiwan Semiconductor is working on integrating CoWoS and SiPh, aiming to launch Co-packaged Optical Devices (CPO) in 2026. Additionally, it is reported that Apple is collaborating with Broadcom to develop AI Chip, which will lead to more L for Taiwan Semiconductor's advanced processes. Furthermore, the company's first factory in Kumamoto Prefecture, Japan is nearing mass production.