On December 12, Gelonghui reported that Huafeng Technology (688629.SH) stated on the interactive platform that the company does not directly engage in the research, development, and manufacturing of optical chips and Semiconductors. The company has successfully developed a full-link low-loss solution and products based on chip-to-chip, chip-to-interface, and backplane-to-subboard connections, and has laid out high-speed optical connection products in the external connection part. This provides technical support for high-speed full-link connection technology for core equipment continuous upgrades for Communication Equipment manufacturers.