Author | Huang Yu

Editor | Liu Baodan

Two years after big models set off a new wave of AI, TCL is finally about to fully present its AI strategy to the outside world.

On December 11, 2024 TCL Global Technology Innovation Conference was held. Since the conference was held for the 11th time, this was the first time that TCL changed it from an internal model to a form of external communication, and AI was used as the main theme of the conference.

Li Dongsheng, founder and chairman of TCL, said that this is the first time that TCL has opened up the display of technological innovation achievements to the entire industry, especially its strategic layout and achievements in emerging technology fields such as AI.

TCL released the “TCL All-Field Full-Scene AI Application Solution”, which includes 5 innovative application practices, including AI intelligent operation, AI simulation, small T central control large model, AI film production, and Xingzhi X-Intelligence 2.0.

Yan Xiaolin, CTO of TCL Technology and director of TCL Industrial Research Institute, pointed out that from the B-side to the C-side, from R&D, manufacturing to operation, from interaction, image quality to platforms, AI is already ubiquitous in TCL.

TCL's business focuses on smart terminals, semiconductor displays, and new energy photovoltaics. According to reports, in 2024, TCL will create 0.54 billion yuan in economic benefits by promoting the implementation of AI applications.

It has become a consensus that AI will reshape all walks of life, and many companies have already gone all in AI.

Li Dongsheng pointed out that the rise of AI is driving industrial transformation, and the disruption of old and new technologies has profoundly affected the global industrial landscape. Currently, artificial intelligence technologies such as big models and generative AI are developing rapidly, and their applications continue to expand in many fields, entering the medical, financial, transportation, and manufacturing industries. Although AI technology development and business models are not yet mature, AI may have explosive opportunities in some fields in the next three to five years.

Li Dongsheng also shared TCL's five major technology development strategies in the face of challenges such as intensifying global technology competition, the rise of AI driving industrial transformation, and the need to improve the innovation ecosystem.

First, adhere to the long-term principle and enhance strategic planning capabilities. In the future, TCL will continue to insist on forward-looking AI technology research and development for the future, focus on core resources, give full play to its global layout advantages, and build core capabilities in key directions, solve actual business needs, and promote the efficient implementation of technology.

The second is to increase original technological breakthroughs to achieve “corner overtaking” in key areas. The third is to be guided by engineering businessman mentality to accelerate the transformation of technological innovation achievements; the fourth is to improve the product structure and break through the middle and high-end markets through technological innovation; and the fifth is to improve the technological innovation ecosystem and gather high-quality innovation resources from around the world.

Li Dongsheng said that in the current market competition, there is no way out for low price competition; it will only fall into an endless “internal roll”. If we want to surpass our rivals, we must strive for more breakthroughs in high-end products.

Technological innovation is an important driving force that helps TCL move through the industry cycle, whether in smart terminals, semiconductor displays, or the photovoltaic industry.

In the semiconductor display field, after 11 years of investment, TCL Huaxing recently announced the official mass production of printed OLEDs.

Li Dongsheng said that as early as ten years ago, TCL Huaxing chose printed OLEDs as the main direction of next-generation display technology. There are two main factors. One is that traditional OLED patents have already been laid out by leading companies. If TCL develops in this field, it will face great patent restrictions. Furthermore, printed OLEDs are more competitive than traditional OLEDs.

Betting on OLED printing means that TCL can continue to maintain its leading position in the semiconductor display field in the future.

In the photovoltaic industry, which is still at the bottom of the industry, technological innovation is an important step for TCL Zhonghuan in seeking a breakthrough.

At the conference, Zhang Xuenan, vice director of TCL Central Research Institute, presented two cutting-edge innovations in large-size ultra-thin silicon wafers and TopCon copper grid modules for smart photovoltaics. This will help produce more efficient and low-cost TopCon batteries and drive the industry to reduce costs and increase efficiency.

Zhang Xuenan said that now there is a shift from type P to type N battery technology because the two models have different material requirements, and N-type single crystals require higher longevity, more concentrated resistors, and even the cleanliness and metal content of the silicon wafer surface. Based on industry technology accumulation, semiconductor-related process technology is also superimposed on N-type silicon wafers, which can improve the quality of silicon wafers while ensuring the best cost performance.

Therefore, large-size ultra-thin silicon wafers for smart photovoltaics are TCL Zhonghuan's differentiated competitive advantage in the silicon wafer direction.

In terms of components, Zhang Xuenan introducedtoThe battery industry has always used silver paste for printing. Silver itself is a precious metal, and the industry cannot bypass this path. Everyone pursues the use of other metals such as silver-coated copper to replace silver. This is the first time that TCL Zhonghuan introduced a copper grid cable component with zero silver content, and it is also the first in the industry, which can further drive the industry to reduce costs.

At the same time, based on copper grid module technology, the effective battery area can be maximized under the same area, and the package density is 1.2% higher than that of conventional products, and with a design where the component has no A surface, the product can prevent the accumulation of water and ash, and the system-side power generation gain of more than 3%.

Under the many challenges of the industry, TCL must always use scientific and technological innovation as a weapon to ensure that it can achieve further breakthroughs in global development.