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苹果据悉正与博通合作开发AI芯片,预计2026年可量产

TMTPost News ·  Dec 12 07:56

钛媒体App 12月12日消息,相关报道援引知情人士称,苹果公司正研发专门为AI设计的服务器芯片,并正与博通合作开发该芯片的网络技术。据悉,新款芯片的内部代号为Baltra,预计到2026年可量产。

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