On December 11, at Gelonghui, Quick Intelligent Equipment (603203.SH) stated on the interactive platform that the demand for AI Chips continues to increase, and the current localization rate of thermal press bonding and hybrid bonding equipment involved in advanced packaging is very low. The company is actively laying out the high-end equipment field for advanced packaging and is developing advanced packaging bonding equipment, expecting to complete the prototype development by 2025.
快克智能(603203.SH)：正进行先进封装键合设备的研发，预计2025年完成样机开发
Quick Intelligent Equipment (603203.SH): is currently developing advanced packaging bonding equipment, with prototype development expected to be completed by 2025.
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