On December 10th, Gelonghui reported that Sitake (301568.SZ) stated on an investor interaction platform that the company's independently developed Machine Vision inspection equipment 3D SPI and 3D AOI can be used for chip solder ball and solder paste inspection in the automotive-grade Semiconductors back-end packaging process.
思泰克(301568.SZ)：3D SPI和3D AOI可用于车规级半导体后道封装过程中的芯片锡球与锡膏检测
STEK (301568.SZ): 3D SPI and 3D aoi can be used for the detection of chip solder balls and solder paste in the automotive-grade semiconductor back-end packaging process.
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