The 10th anniversary flagship released by Xiaomi recently, the Xiaomi Mi 10, has been unveiled. As a commemorative product to celebrate Xiaomi's 10th anniversary, Xiaomi has used enough material this time.

At the press conference, Xiaomi popularized concepts such as WiFi6 and LPDDR5, and brought a cost-effective WiFi6 router. All of this is also paving the way for IoT to meet new changes in the 5G era.

So what exactly is the internal structure of the Xiaomi 10 series this time around? Through the dismantling of XYZone, we can see that the overall internal design has improved a lot compared to before. The internal heat dissipation is all-round. Copper pipes, VC heating plates, silicone grease, etc. are not uncommon. The most important components on the Xiaomi Mi 10 motherboard are basically figures from Qualcomm and Samsung.

Although the CEO of Qualcomm said “the first task in 2020 is to provide the Apple iPhone 12 with the X55 5G baseband” this year, the Android camp is still inseparable from Qualcomm. Perhaps Qualcomm can't help but be happy in 2020.