Shenzhen strongteam decoration engineering (002989.SZ): The products of CRRC are primarily used in the packaging of high-performance chips such as CPU, GPU, AI, and automotive applications.

Gelonghui Finance · Nov 28, 2024 15:45

On November 28, Gelonghui reported that shenzhen strongteam decoration engineering (002989.SZ) stated on the investor interaction platform that the main business planned by Kereis is the production and sales of FCBGA (ABF) high-end substrates, which are mainly used for packaging high-performance chips such as CPU, GPU, AI, and automotive. FCBGA substrates belong to IC substrates, which are essential parts of the chip packaging process. The project focuses on the R&D and mass production of FCBGA substrates (ABF substrates), aiming to alleviate the current shortage of packaging substrates caused by the surge in testing demand, while also filling the domestic process gap in FCBGA. Currently, the company indirectly holds 33.3784% of Kereis's equity and has a significant influence on it.

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中天精装(002989.SZ)：科睿斯产品主要应用于CPU、GPU、AI及车载等高算力芯片的封装

Shenzhen strongteam decoration engineering (002989.SZ): The products of CRRC are primarily used in the packaging of high-performance chips such as CPU, GPU, AI, and automotive applications.

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