GLENOVA reported on November 27th that eoptolink technology inc. (300502.SZ) stated on the investor interaction platform that the company already has the packaging process technology conditions required for CPO wafer level.
新易盛(300502.SZ)：已具备cpo晶圆级需要的封装工艺技术条件
eoptolink technology inc. (300502.SZ): already has the packaging process technology conditions required for cpo wafer level.
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