On November 27, 2023, at the investor interaction platform, wuhan dr laser technology corp. (300776.SZ) stated that its TGV laser micropore equipment, through a precision control system and laser modification technology, achieves micropore and microgroove processing of glass substrates made from different materials, providing conditions for subsequent metallization processes. This equipment can be applied in areas related to semiconductor chip packaging, display chip packaging, and others. Currently, the company has completed the shipment of panel-level glass substrate through-hole equipment, achieving full coverage of wafer-level and panel-level TGV packaging laser technology.
帝尔激光(300776.SZ)：已经完成面板级玻璃基板通孔设备的出货
Wuhan dr laser technology corp. (300776.SZ): has completed the shipment of panel-level glass substrate through-hole equipment.
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