share_log

深南电路(002916.SZ):封装基板业务产品包括模组类封装基板、应用处理器芯片封装基板等

Shennan Circuits (002916.SZ): The packaging substrate business products include module-type packaging substrates, application processor chip packaging substrates, etc.

Gelonghui Finance ·  Nov 26, 2024 19:59

On November 26, GELONGHUI reported that shennan circuits (002916.SZ) stated in their investor relations that the company's packaging substrate business has a wide variety of product coverage, including module packaging substrates, storage packaging substrates, application processor chip packaging substrates, etc., mainly applied in mobile smart terminals, server/storage, and other fields. In the third quarter of 2024, the downstream market demand for packaging substrates has slowed, and the company's packaging substrate product structure has been adjusted in response to fluctuations in downstream market demand.

The translation is provided by third-party software.


The above content is for informational or educational purposes only and does not constitute any investment advice related to Futu. Although we strive to ensure the truthfulness, accuracy, and originality of all such content, we cannot guarantee it.
    Write a comment