Shenzhen Laibao Hi-Tech (002106.SZ) stated at the investor relations event on November 26 that, in order to cultivate new business growth points for the company's future sustainable development, starting from 2023, the company will utilize existing 2.5-generation TFT-LCD panel production line equipment and technological resources, while adding necessary equipment, to collaborate with partners in the design and process development of new glass encapsulation carrier board products. As of now, the company has independently/cooperatively designed and produced multiple glass encapsulation carrier board test samples, including glass encapsulation carrier boards (MIP) that can be used for Mini/MicroLED displays and panel-level glass encapsulation carrier boards (PLP) that can be matched with chips, but have not yet been commercialized. In the future, the company will actively seek potential customer resources when conditions are met, further delve into the design, development, verification, sample production, and product certification of glass encapsulation carrier board products. The R&D progress of the company's new products, new processes, and new technologies, as well as the realization of commercialization and industrial production, have certain uncertainties, please refer to the company's subsequent announcements for specific progress if any.