Tongfu Microelectronics (002156.SZ) stated on the investor interaction platform on November 26 that the company is vigorously developing fan-out, wafer-level, and flip-chip packaging technologies and expanding its production capacity. In addition, actively laying out top-notch packaging technologies such as Chiplet and 2D+ to form differentiated competitive advantages. As of now, the company has no related business cooperation with nvidia.
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- Tongfu Microelectronics (002156.SZ): The company currently has no business cooperation with nvidia.
通富微电(002156.SZ)：公司暂无与英伟达的相关业务合作
Tongfu Microelectronics (002156.SZ): The company currently has no business cooperation with nvidia.
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The above content is for informational or educational purposes only and does not constitute any investment advice related to Futu. Although we strive to ensure the truthfulness, accuracy, and originality of all such content, we cannot guarantee it.
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Risk Disclaimer
The above content is for informational or educational purposes only and does not constitute any investment advice related to Futu. Although we strive to ensure the truthfulness, accuracy, and originality of all such content, we cannot guarantee it.
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