On November 26th, Guolonghui reported that tongfu microelectronics (002156.SZ) stated on the investor interaction platform that the company is an integrated circuit packaging and testing service provider, offering a one-stop service from design simulation to packaging testing for global customers. The company's products, technology, and services cover a wide range of areas including ai, high-performance computing, big data storage, display drivers, 5G and other network communications, information terminals, consumer terminals, internet of things, autos electronics, industrial control, meeting diverse customer needs. The company seizes market development opportunities, focusing on future high value-added products and market hotspots, positioning itself for the long term by vigorously developing fan-out, wafer level, flip-chip and other packaging technologies, expanding its production capacity; furthermore, actively deploying top-notch packaging technologies like Chiplet, 2D+, establishing a differentiated competitive advantage.