H.B. Fuller (301297.SZ) announced that the company plans to issue shares and convertible...
According to the Zhitong Finance app, H.B. Fuller (301297.SZ) issued an announcement, planning to issue shares and convertible bonds to 59 trading parties including Shanghai Shenhe, to purchase 100% equity of Jiangsu Fulehua Semiconductor Technology Co., Ltd. (referred to as Fulehua), held by them, and to issue shares to raise matching funds from up to 35 specific investors, with a transaction price (excluding the amount of matching funds raised) of 6.55 billion yuan.
The controlling shareholder's subsidiary acquired this time, Fulehua, mainly engages in the research, design, production, and sale of power semiconductor copper-clad ceramic substrates. Fulehua independently masters various advanced manufacturing processes of copper-clad ceramic substrates and is one of the few manufacturers in China and abroad that achieve full in-house production of copper-clad ceramic substrates, holding a leading position in the industry. Fulehua's main customers include STMicroelectronics, Infineon, BorgWarner, Fuji Electric, BYD, H.B. Fuller, CRRC Times Electric, all of which are well-known enterprises in the industry.
This acquisition helps the listed company integrate high-quality semiconductor industry resources within the group, promote the introduction of high-quality semiconductor component material manufacturing business, better provide customers with high value-added comprehensive one-stop services, help the listed company become stronger and more competitive, and further enhance the company's core competitiveness.