On November 20, Gelonghui reported that shengyi technology (600183.SH) stated on the investor interactive platform that the company had made related technical arrangements for substrate materials used in package substrates at an earlier stage, benchmarking against international benchmark companies in this field, covering different material technical routes, and developing exclusive substrate materials for application with end users. Different packaging forms have different material requirements; we have already applied Wire Bond type packaging substrate products in large quantities, mainly in the fields of sensors, card types, RF, cameras, fingerprint recognition, storage products, etc., and there have been bulk applications in advanced packaging fields. We have also developed and applied in higher-end products represented by FC-CSP and FC-BGA packaging for AP, CPU, GPU, and AI-related products.