On November 19, Gelonghui reported that hangzhou huaguang advanced welding materials (688379.SH) stated on its investor interaction platform that the conductive adhesives, silver-copper-titanium solder pastes, and other products developed by the company are used in the semiconductor packaging field. Among them, the conductive adhesive products have passed the first sample tests of two clients, while the silver-copper-titanium solder paste products are mainly applied in the insulated gate bipolar transistor (igbt) AMB ceramic substrates, and the company is currently promoting the research and development.
华光新材(688379.SH)：研发的导电胶、银铜钛焊膏等产品应用于半导体封装领域
Hangzhou Huaguang Advanced Welding Materials (688379.SH): The developed conductive adhesive, silver-copper-titanium solder paste and other products are applied in the semiconductor packaging field.
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