原告人向公司提出申索，其中包括：（i）上述各项本金金额;（ii）2023年8月6日起至还款日期未偿还本金的利息;（iii）进一步及/或其他补救办法;以及（iv）诉讼费用。截至本公告日期，原告人与公司正在积极就债券工具项下未偿还本金及累计利息的还款安排进行谈判。Chinlink Intl (00997.HK) announced on November 8 that on October 29, 2024, the board of directors received two sets of summonses accompanied by statements of claim from two bond holders (referred to collectively as the plaintiffs) regarding the 6.5% coupon bonds issued by the company on August 7, 2019, and subsequently amended on August 6, 2020, August 23, 2021, and August 12, 2022, in the High Court of Hong Kong against the company (as the defendant) and others.
According to the statement of claim, Plaintiff A claims that as of October 28, 2024, the company owes Plaintiff A a total outstanding principal amount of HK $8,500,000.00 under the bond instrument and interest on unpaid principal from August 6, 2023, to the date of repayment.
According to the statement of claim, Plaintiff B claims that as of October 28, 2024, the company owes Plaintiff B a total outstanding principal amount of HK $10,000,000.00 under the bond instrument and interest on unpaid principal from August 6, 2023, to the date of repayment.
The plaintiffs have made claims against the company, including (i) the aforementioned principal amounts; (ii) interest on unpaid principal from August 6, 2023, to the date of repayment; (iii) further and/or other remedial measures; and (iv) litigation costs. As of the date of this announcement, the plaintiffs and the company are actively negotiating repayment arrangements for the outstanding principal and accrued interest under the bond instrument.
