The Ultra C Tahoe now achieves the performance of standalone single-wafer cleaning tools on low-to-medium temperature sulfuric peroxide mix (SPM) processes. Tahoe's patented hybrid architecture is among the first in the industry to combine batch wafer processing and single wafer cleaning chambers into the same SPM tool. The hybrid architecture delivers enhanced cleaning performance, high throughput, and process flexibility, with up to 75% reduction in chemical consumption. ACM estimates cost savings of up to $500,000 per year from sulfuric acid alone, with additional environmental and cost benefits from reduced sulfuric acid treatment and disposal.