Uspace Tech (01725) announced that on November 4, 2024 (after trading hours), the company entered into a placing agreement with the placing agent. The company plans to issue bonds with a principal amount of up to 0.1 billion Hong Kong dollars through the placing agent, with an annual interest rate of 10 basis points.

Assuming the bonds are fully placed, a net proceeds of approximately 89.8 million Hong Kong dollars will be raised for general operating capital and general corporate purposes, including but not limited to aerospace business and possible future investments by the group.