Longtu Lithography (688721.SH) stated during a specific investigation that the Zhuhai fundraising project is expected to achieve small-scale trial production of third-generation semiconductor masks by the end of this year, and is expected to achieve stable mass production by 2025. The planning for the 28nm process node has already been initiated.

Breaking through to higher process nodes poses major challenges: (1) With the continuous improvement of semiconductor processes, the requirements for masks are becoming increasingly stringent. Therefore, semiconductor masks have higher requirements for minimum linewidth, positional accuracy, CD precision, defect control, etc., resulting in high process difficulty and technological barriers. (2) With the increasing requirements for the horizontal line seam of masks, the optical effects on downstream wafers become more prominent during exposure with lithography machines, leading to distortion and deformation of actual lithographic patterns compared to chip design patterns, severely impacting chip performance and yield. (3) To achieve advanced processes such as 28nm and below, it requires coordination among the domestic industry chain. Currently, foreign trade restrictions and technological blockades have partially constrained the production equipment for advanced processes.