Gelonghui on October 22nd | Tiancheng Technology (688603.SH) stated on the investor interaction platform that the company's main products currently cover the optical chip field, mainly used in compound semiconductor production and packaging processes, including processes such as gold plating, copper plating, nickel plating, tin-silver alloy plating, etc. The company is also actively developing more related products to provide various functional wet electronic chemical materials support for the optical chip industry.
天承科技(688603.SH)：目前主要产品可以覆盖光芯片领域
Tiansheng Technology (688603.SH): Currently, the main products can cover the field of optical chips.
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