Jiuzhouhui, October 21st. Ningbo Boway Alloy Material (601137.SH) stated on the investor interaction platform that the company will not directly cooperate with Taiwan Semiconductor. However, the company's lead frame special materials will be used for chip packaging before the third generation; The socket base special material is mainly used to connect advanced packaging chips and substrates. With the development of AI, the market focuses on AI computing chips. Advanced packaging is an important way to package AI computing chips. The socket base connection method can be applied to chips produced in more advanced packaging methods.