Gelonghui October 17th, Tiancheng Technology (688603.SH) investor relations activity record shows that the company is currently conducting continuous testing and verification with more than ten downstream customers, while also achieving small-scale product sales. It is currently actively collaborating with equipment manufacturers and customers to promote the maturity of related technologies. Compared to TGV, TSV typically has a smaller opening diameter and a larger depth-to-diameter ratio, requiring the exchange of chemicals at the bottom of the silicon vias. The difficulty of TGV filling hole plating lies in how to quickly achieve connection in the middle of the via and improve the efficiency of the plating process.