Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor communication platform on September 30 that the company's FCBGA packaging substrate can be used for the packaging of ai chips, and its existing processes and technical capabilities can meet the requirements of related products.
兴森科技(002436.SZ)：FCBGA封装基板可用于AI芯片的封装
Shenzhen Fastprint Circuit Tech (002436.SZ): FCBGA packaging substrate can be used for the packaging of ai chips.
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