Macro Micro Technology (688711.SH) stated on the investor interaction platform on September 27th that, in addition to the stable development of its traditional silicon-based business, the company is actively laying out SiC chip and packaging business. As of the first half of 2024, the company has made substantial progress in the SiC field, including: 1. Chip products: Successfully developed the 1200V 40mohm SiC MOSFET chip, which has passed reliability verification; the automotive-grade 1200V 13mohm SiC MOSFET chip is actively under development; the independently developed SiC SBD chip has passed reliability verification and system-level verification by multiple end customers, and has undergone relevant reliability and board-level performance tests at key customer sites, with some products already in small-scale shipments. 2. Module products: The automotive-grade 1200V SiC self-developed module is under development, and the corresponding silver sintering process has passed reliability verification, providing a solid technical platform for the development of the next generation of automotive-grade module products; the custom three-level SiC hybrid module for Uninterruptible Power Supply (UPS) systems has been developed and is already in mass production. With the gradual mass production and market promotion of third-generation compound semiconductor devices, the company is expected to gain a more important position in the power semiconductor market.