Techfort Technology (688072.SH) stated on the interactive platform on September 20 that the company has independently developed and launched hybrid bonding equipment. Among them, wafer-to-wafer bonding equipment and chip-to-wafer surface pre-treatment equipment have passed customer verification in 2023, achieving industrial application and selling 3 units. In the first half of 2024, both products received repeat orders from customers. In addition, the company has independently developed bonding alignment accuracy measurement products and has obtained customer orders. The performance and capacity indicators of the company's wafer-to-wafer bonding equipment have reached the international leading level.